Note: You can zoom in pictures by clicking/taping it, some are unavailable.
Oh yeah guys, a few days ago, again, and nobody knows how they got another 3DS off the assembly line and ...completely destroyed it, but for a good reason.
To show the world how a 3DS looks like from inside.
I will fill in all the information i know about the hardware alongside with some pictures, specially resized for DSiPaint, you just have to click them
Right side shoulder button aka "trigger", being dismantled, as you can see the green part is the internal 1st CPU, the one located in the bottom screen.
I would like to tell you what is this but i have no idea, all i can see is that in the bottom it is written "C1P1" and in the left side "3R3", geeky isn't it? if anybody knows please leave a comment
Here is why the 3DS doesn't have a longer battery life, as you can see the 840mAh DSi battery (left side device, picture) is already big enough to take a good space where everything needs to be as small as possible, the 3DS battery is fat and almost as big as of its predecessor it is a 1300mAh li-ion battery, the Nintendo DSi XL (has a 1050mAh battery) is located among the DSi (left) and the 3DS (right side), click to enlarge.
This one is the back of 3DS's sub-printed circuit boards, the big shiny silver compartment is where the game card goes.
This is one of the shoulder buttons, or "triggers", at one of Iwata asks interviews it was told they were made stress resistant and won't break easy, it was told they are made out of some kind metal as well, and are as "clicky" as the DSi/DSi XL, unlike the DS lite.
Here is the front of the 1st sub-printed circuit board, the CPU1, that big hole at the left side is where the slide pad is located at, every button, A X B Y, d-pad, and slide pad were made out of a metal and are stress resistant.
Here is a zoom in the new Start, Home and Select buttons, we can also see the headphones output jack
http://i55.tinypic.com/2ccntsl.jpg
last but not least...uhmm...i have no idea of what is this, maybe some part related to the battery? at least it is interesting.
Now lets talk a little bit more about the graphics, which hardware makes them and how, specifically how powerful they are.
The Nintendo 3DS graphics processor unit, aka GPU is the PICA200, it is not manufactured by nintendo, so it is a third party module unlike DS's GPU's.
(figurative image)
With the pica200 GPU, the Nintendo 3DS will be capable of making graphics at a Clock frequency of 200 MHz (max. 400 MHz at 65 nm) with a pixel performance of 800 Million pixel per second (400 Million pixel per second at 100 MHz).
The vertex performance will be of 15.3 Million polygons per second (40Mtriangle/s at 100 MHz)
Developers already said making textures and ligh effects is very easy on the 3DS, which is very good, because it opens a whole world of possibilities in a shorter way, saving time and money.
Here is a little of what the pica200 can do in a more specific way:
C1P1 is actually two different labels. C1 relates to the capacitor on the left and P1 is the processor/chip thats above it. (Actually it's a chip socket and the chip will get put in later)
The unknown part looks like it might be the aerial, but thats just a guess.
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